Parameters of 43223-8140 Low Profile RJ45 Jack:
| Product Category |
Modular Jacks and Plugs
|
| Port Configuration |
1x4
|
| Light pipes /LEDs |
None |
| Positions / Loaded Contacts |
8/8 |
| Orientation |
Right Angle (Side Entry) |
| Termination Interface Style |
Through Hole |
| Lead-Free Process Capability |
WAVE |
| PoE |
N/A |
| Jack Height |
12.83mm |
| PCB Locator |
Yes |
| PCB Retention |
Yes |
| PCB Thickness - Recommended |
1.57mm |
| Pitch - Mating Interface |
1.02mm |
| Pitch - Termination Interface |
1.27mm |
| Current - Maximum per Contact |
1.5A |
| Shielded |
No |
| Voltage - Maximum |
150V AC (RMS) |
| Material - Metal |
Phosphor Bronze |
| Material - Plating Mating |
Gold |
| Material - Plating Termination |
Tin |
| Material - Resin |
High Temperature Thermoplastic |
| Color - Resin |
Black |
| Durability |
500 mating cycles max |
| Operating Temperature Range |
-40° to +85°C |
| Flammability |
94V-0 |
MECHANICAL REQUIREMENTS of 43223-8140 8P8C Jack:
|
DESCRIPTION
|
TEST CONDITION
|
REQUIREMENT
|
|
Connector Mate Force
|
Mate connector at a rate of
25 ± 6 mm (1 ± ¼ inch) per minute.
(Gage dimensions in Section 7.0)
|
22 N (5 lbf)
MAXIMUM insertion force
|
|
Durability
|
Mate connectors up to 500 cycles at a
maximum rate of 20 cycles per minute prior
to Environmental Tests.
|
10 milliohms MAXIMUM
(change from initial)
|
|
Vibration
(Random)
|
Mate connectors and vibrate per
MIL-STD-202
|
10 milliohms MAXIMUM
(change from initial)
&
Discontinuity < 1 microsecond
|
|
Plug Retention Force
|
Apply an axial pullout force on the plug at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
|
89 N (20 lbf)
MINIMUM retention force
|
|
PCB Separation Forces
|
Apply a perpendicular load on the plug at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
|
4.5 N (1 lbf)
MINIMUM withdrawal force
before solder reflow
89 N (20 lbf)
MINIMUM withdrawal force
after solder reflow
|
The Key Roles of PCB Locator and PCB Retention in Modular Jack:
PCB Locator: Helps to accurately locate the module jack on the PCB, ensuring that the pins are properly aligned with the PCB pads. It can improve assembly efficiency.
PCB Retention: Ensures that the module jack is firmly fixed to the PCB to prevent movement during handling, soldering or operation.
NOTES:
1) MATERIAL:
HOUSING: GLASS FILLED NYLON, UL94V-0, COLOR: BLACK
INSULATOR: GLASS FILLED NYLON, UL94V-0, COLOR: BLACK
TERMINALS: PHOSPHOR BRONZE: .012/ 0.30 THICK
2) FOR 6 CIRCUIT JACKS CENTERLINE TO CENTERLINE SPACING IS .448/ 11.38,
FOR 8 CIRCUIT JACKS CENTERLINE TO CENTERLINE SPACING IS .550/ 13.97.
